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F11AFIM13-B1 is a highly integrated module with low power 802.11n Wireless LAN(WLAN) network controller. It combines an ARM-CM3 MCU, WLAN MAC, a 1T1R capable WLAN baseband, and RF function. It also provides a bunch of configurable GPIO which are configured as digital peripherals for different applications and control usage.
F11AFIM13-B1 integrates internal memories for complete WIFI protocol functions. F11AFIM13-B1 integrates 1MB ROM to provide high access speed, low leakage memory. The ROM memory clock speed is up to 166MHz. The ROM lib provides the following functions:
Boot Code and MCU initialization. Default UART driver. Non-flash booting functions and drivers. Peripheral libs. Security functions libs.
1.2 Product Features
General
22.6mm*13.0mm*1.7mm CMOS MAC, Baseband PHY, and RF in the module for 802.11b/g/n compatible WLAN Complete 802.11n solution for 2.4G band 150Mbps receive PHY rate and 150Mbps transmit PHY rate using 40MHz bandwidth
Standards Supported
802.11b/g/n compatible WLAN 802.11e QoS Enhancement(WMM) 802.11i(WPA, WP2). Open, shared key, and pair-wise key authentication services WiFi Direct support Light Weight TCP/IP protocol
WLAN PHY Features
802.11n OFDM One Transmit and one Receive path(1T1R) 20MHz and 40MHz bandwidth transmission Short Guard Interval(400ns) Maximum data rate 54Mbps in 802.11g and 150Mbps in 802.11n
4.3 Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature: <250° C Number of Times: ≤ 2 times
4.4 Patch WIFI modules installed before the notice:
WIFI module installed note: 1. Please press 1: 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil 2. Take and use the WIFI module, please insure the electrostatic protective measures. 3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 º C for the MID motherboard.
About the module packaging, storage and use of matters needing attention are as follows: 1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: Temperature in: < 40 º C, relative humidity: < 90% r. H. 2. The module vacuum packing once opened, time limit of the assembly: Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption. 2. ) factory environmental temperature humidity control: <= 30 º C, <= 60% r. H... 3). Once opened, the workshop the preservation of life for 168 hours. 3. Once opened, such as when not used up within 168 hours: 1). The module must be again to remove the module moisture absorption. 2). The baking temperature: 125 º C, 8 hours. 3. ) After baking, put the right amount of desiccant to seal packages.