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Realtek RTL8189ETV 11n WiFi LGA Module (F89ETSM13-W2)

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Basic Info.

Model NO.
F89ETSM13-W2 12.0X12.0X1.8, 3.3V
Color
Blue
Certification
ISO9001, FCC
Main Chipset
Realtek Rtl8189ETV
Operating Frequency
2.400~2.4835GHz
Transport Package
Blister & Take-up
Specification
CE, ROHS, FCC
Trademark
FN-LINK
Origin
Shenzhen
Production Capacity
2000000PCS/Year

Product Description

Product Specification

IEEE 802.11 b/g/n 2.4GHz 1T1R SDIO LGA Module

1. Introduction

1.1 Overview

F89ETSM13-W2 is a highly integrated and excellent performance Wireless LAN (WLAN) USB2.0 network interface device. High-speed wireless connection up to 150 Mbps.

The general hardware for the module is shown in Figure 1. This WLAN Module design is based on Realtek RTL8189ETV. It is a highly integrated single-chip 1*1 MIMO (Multiple In Multiple Out) Wireless LAN (WLAN) SDIO network interface controller complying with the 802.11n specification. It combines a MAC, a 1T1R capable baseband, and RF in a single chip. It is designed to provide excellent performance with low power Consumption and enhance the advantages of robust system and cost-effective.


1.2 Product Features


Operate at ISM frequency bands (2.4GHz) l
SDIO Interface for WiFi
IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n,
Enterprise level security which can apply WPA/WPA2 certification for WiFi. L
WiFi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps downstream and 150 Mbps upstream PHY rates
2. GENERAL SPECIFICATION
2.1 WiFi RF Specifications


2.2 Power Consumption




3. Mechanical Specification

3.1 Outline Drawing


3.2 PCB LAYOUT (Unit: ± 0.15mm)


3.3 PIN Assignment


4. Environmental Requirements

4.1 Operating & storage temperature



4.2 Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature: <250° C
Number of Times: ≤ 2 times

4.3 Patch WIFI modules installed before the notice:

WIFI module installed note:
1. Please press 1: 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil
2. Take and use the WIFI module, please insure the electrostatic protective measures.
3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 º C for the MID motherboard.

About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: Temperature in: < 40 º C, relative humidity: < 90% r. H.
2. The module vacuum packing once opened, time limit of the assembly:
Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption.
2. ) factory environmental temperature humidity control: <= -30º C, <= 60% r. H...
3). Once opened, the workshop the preservation of life for 168 hours.
3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption.
2). The baking temperature: 125 º C, 8 hours.
3. ) After baking, put the right amount of desiccant to seal packages.

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360° Virtual Tour

Diamond Member Since 2015

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Manufacturer/Factory & Trading Company
Number of Employees
173
Year of Establishment
2015-02-02