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F92EUUM23 11n 2T2R WiFi Module

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Basic Info.

Model NO.
F92EUUM23
Color
Blue
Certification
ISO9001
Main Chipset
Realtek Rtl8192EU
Host Interface
USB 2.0
Transport Package
Plasstic & Paper Case
Specification
ROHS, CE, FCC
Trademark
FN-LINK
Origin
Shenzhen
Production Capacity
2000000PCS/Year

Product Description


1. Introduction

F92EUUM23 is a highly integrated and excellent performance Wireless LAN (WLAN) USB network interface device. High-speed wireless connection up to 300 Mbps.

1.1 Overview
The general hardware for the module is shown in Figure 1. This WLAN Module design is based on Realtek RTL8192EU. It is a highly integrated single-chip 2*2 MIMO (Multiple In Multiple Out) Wireless LAN (WLAN) USB network interface controller complying with the 802.11n specification. It can work in two modes: Infrastructure and Ad-Hoc It combines a MAC, a 2T2R capable baseband, and RF in a single chip. It is designed to provide excellent performance with low power Consumption and enhance the advantages of robust system and cost-effective.

1.2 SPECIFICATION REFERENCE

This specification is based on additional references listed as below.
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n


1.3 System Characteristics




Mechanical Specification

2.1 Outline Drawing(Unit: ± 0.15mm)


2.2 Pin Definition









2.3 Layout reference(Unit: Mm)



2.4 Application Circuit



3. Electric Current
Test Environment: Win XP SP3, Voltage: 3.3V


4. Package

4.1 blister packaging


A piece of 100 PCS
4.2 the take-up package


A roll of 2000pcs




5. User's Manual

5.1 Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature: <250° C
Number of Times: ≤ 2 times

5.2 Patch WIFI modules installed before the notice:
WIFI module installed note:
1. Please press 1: 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil
2. Take and use the WIFI module, please insure the electrostatic protective measures.
3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 º C for the MID motherboard.

About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: Temperature in: < 40 º C, relative humidity: < 90% r. H.
2. The module vacuum packing once opened, time limit of the assembly:
Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption.
2. ) factory environmental temperature humidity control: <= 30% º C, <= 60% r. H...
3). Once opened, the workshop the preservation of life for 168 hours.
3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption.
2). The baking temperature: 125 º C, 8 hours.
3. ) after baking, put the right amount of desiccant to seal packages.

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360° Virtual Tour

Diamond Member Since 2015

Suppliers with verified business licenses

Manufacturer/Factory & Trading Company
Number of Employees
173
Year of Establishment
2015-02-02