Product Specification
IEEE 802.11 b/g/n 2.4GHz 1T1R WiFi Module
1. Introduction
1.1 Overview
FN-8112MET-V2.5-10 is a highly integrated and excellent performance Wireless LAN (WLAN) USB2.0 network interface device. High-speed wireless connection up to 150 Mbps.
The general hardware for the module is shown in Figure 1. This WLAN Module design is based on Realtek RTL8188ETV. It is a highly integrated single-chip 1*1 MIMO (Multiple In Multiple Out) Wireless LAN (WLAN) USB2.0 network interface controller complying with the 802.11n specification. It combines a MAC, a 1T1R capable baseband, and RF in a single chip. It is designed to provide excellent performance with low power Consumption and enhance the advantages of robust system and cost-effective.
1.2 Product Features
Operate at ISM frequency bands (2.4GHz) lUSB Interface for WiFi IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, Enterprise level security which can apply WPA/WPA2 certification for WiFi. lWiFi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps downstream and 150 Mbps upstream PHY rates
2. GENERAL SPECIFICATION
2.1 WiFi RF Specifications
Features |
Descriptions |
Main Chipset |
RTL8188ETV |
Frequency Range |
2.400~2.4835GHz |
Operating Voltage |
3.3Vdc ±10% I/O supply voltage |
Host Interface |
WiFi: USB |
Standards |
WiFi:
IEEE 802.11b,
IEEE 802.11g,
IEEE 802.11n, |
Modulation |
WiFi:
802.11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps),
802.11 g/n: OFDM |
PHY Data rates |
WiFi:
802.11b: 11,5.5,2,1 Mbps
802.11g: 54,48,36,24,18,12,9,6 Mbps
802.11n: up to 150Mbps |
Transmit Output Power |
WiFi:
802.11b@11Mbps 16±2dBm
802.11g@6Mbps 14±2dBm
802.11g@54Mbps 14±2dBm
802.11n@65Mbps 13±2dBm (MCS 0_HT20)
13±2dBm (MCS 7_HT20)
13±2dBm (MCS 0_HT40)
13±2dBm (MCS 7_HT40) |
EVM |
802.11b /11Mbps : EVM<=-9dB
802.11g /54Mbps : EVM<=-25dB
802.11n /65Mbps : EVM<=-28dB |
Receiver Sensitivity
(HT 20) |
802.11b@8% PER
1Mbps -88±1dBm
2Mbps -87±1dBm
5.5Mbps -85±1dBm
11Mbps -82±1dBm |
802.11g@10% PER
6Mbps -86±1dBm
9Mbps -85±1dBm
12Mbps -84±1dBm
18Mbps -82±1dBm
24Mbps -80±1dBm
36Mbps -77±1dBm
48Mbps -73±1dBm
54Mbps -71±1dBm |
802.11n@10% PER
MCS 0 -83±1dBm
MCS 1 -82±1dBm
MCS 2 -80±1dBm
MCS 3 -78±1dBm
MCS 4 -75±1dBm
MCS 5 -71±1dBm
MCS 6 -69±1dBm
MCS 7 -67±1dBm |
Operating Channel |
WiFi 2.4GHz:
11: (Ch. 1-11) - United States(North America)
13: (Ch. 1-13) - Europe
14: (Ch. 1-14) - Japan |
Media Access Control |
WiFi: CSMA/CA with ACK |
Network Architecture |
WiFi: Ad-hoc mode (Peer-to-Peer )
Infrastructure mode
Software AP
WiFi Direct |
Security |
WiFi: WPA, WPA-PSK, WPA2, WPA2-PSK, WEP 64bit & 128bit, |
Antenna |
External |
OS Supported |
Android /Linux/ Win CE /iOS /XP/WIN7 |
Dimension |
Typical L13.0*W12.20*H2.0mm |
2.2 Power Consumption
Power Consumption
(Typical by using SWR) |
WiFi only:
TX Mode: (Continuous mode) 185mA (MCS7/BW40/13dBm)
RX Mode: (Continuous mode) 145mA (MCS7/BW40/-68dBm)
LINK:140mA
DISABLE:40mA |
3. Mechanical Specification
3.1 Outline Drawing (Unit: ±0.15mm)
3.2 PIN Assignment
3.3 Recommended Footprint
4. Environmental Requirements
4.1 Operating& Storage Conditions
Operating |
Temperature: 0°C to +55°C |
Relative Humidity: 10-90% (non-condensing) |
Storage |
Temperature: -40°C to +80°C (non-operating) |
Relative Humidity: 5-90% (non-condensing) |
MTBF (Mean Time Between Failures) |
Over 150,000hours |
4.2 Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : ≤2 times
4.3 Patch WIFI modules installed before the notice:
WIFI module installed note:
1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil
2. Take and use the WIFI module, please insure the electrostatic protective measures.
3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ºC for the MID motherboard.
About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 ºC, relative humidity: < 90% r.h.
2. The module vacuum packing once opened, time limit of the assembly:
Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption.
2.) factory environmental temperature humidity control: <= 30% ºC, <= 60% r.h..
3). Once opened, the workshop the preservation of life for 168 hours.
3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption.
2). The baking temperature: 125 ºC, 8 hours.
3.) After baking, put the right amount of desiccant to seal packages.
5. PACKING INFORMATION